Heat sink LGA115X-1U3E 110W square motherboard copper heat sink 1150 1151 1155 1156 1200 server CPU fan heat sink

Product Description

⚙️
Model
LGA115X-1U3E
Power TDP
110W
🌀
Fan Control
PWM 4-Pin
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Material
Copper Base & Fins
Product Description
Product model LGA115X-1U3E
Product size 83mm*83mm*28mm
Fan speed PWM 2000-5000RPM
Noise value 54.80dBA (MAX)
Air volume 10.37CFM (MAX)
Fan plug 4pin PWM
Bearing type double ball
Material quality copper base + copper fins
Power consumption 110W
Voltage 12V
LGA115X-1U3E details
LGA115X-1U3E overview
LGA115X-1U3E heatsink
LGA115X-1U3E dimensions
LGA115X-1U3E base
LGA115X-1U3E installation
LGA115X-1U3E packaging
LGA115X-1U3E structural drawing
LGA115X-1U3E features
Specification
Semi-Automatic PET Bottle Blowing Machine Bottle Making Machine Bottle Moulding Machine
PET Bottle Making Machine is suitable for producing PET plastic containers and bottles in all shapes.
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Semi-Automatic PET Bottle Blowing Machine Bottle Making Machine Bottle Moulding Machine PET Bottle Making Machine is suitable for producing PET plastic containers and bottles in all shapes.
Semi-Automatic PET Bottle Blowing Machine Bottle Making Machine Bottle Moulding Machine PET Bottle Making Machine is suitable for producing PET plastic containers and bottles in all shapes.
FAQ
What are the main dimensions of this CPU cooler?
The LGA115X-1U3E CPU cooler measures 83mm x 83mm x 28mm, making it specifically designed for low profile 1U server chassis.
Which socket platforms is this cooler compatible with?
This cooler is compatible with Intel LGA115X socket configurations, including LGA 1150, 1151, 1155, and 1156.
What type of bearing does the cooling fan use?
It features a high-reliability double ball bearing system, designed for durable, continuous operation in server environments.
Does this model support PWM speed control?
Yes, the fan comes with a 4-pin PWM interface, enabling dynamic speed control from 2000 up to 5000 RPM based on temperature.
What is the maximum TDP (Power consumption) this cooler can handle?
The LGA115X-1U3E is built to handle CPU power thermal dissipation up to a maximum TDP of 110W.
What material is the heatsink made of?
The heatsink structure is constructed using a high-density pure copper base paired with copper fins for optimal thermal dissipation.

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